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INTEGRATED CIRCUITS
DATA SHEET
TDA9817; TDA9818 Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
Product specification Supersedes data of 2001 Oct 19 2004 Jun 29
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
FEATURES * 5 V supply voltage * Applicable for Intermediate Frequencies (IFs) of 38.9, 45.75 and 58.75 MHz * Gain controlled wide band Video IF (VIF) amplifier (AC-coupled) * True synchronous demodulation with active carrier regeneration (very linear demodulation, good intermodulation figures, reduced harmonics and excellent pulse response) * Robustness for over-modulation better than 105% due to gated phase detector at L/L accent standard and PLL-bandwidth control at negative modulated standards * Voltage Controlled Oscillator (VCO) frequency switchable between L and L accent (alignment external) picture carrier frequency * VIF Automatic Gain Control (AGC) detector for gain control, operating as peak sync detector for B/G, peak white detector for L; signal controlled reaction time for L * Tuner AGC with adjustable TakeOver Point (TOP) * Automatic Frequency Control (AFC) detector without extra reference circuit ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA9817T TDA9817TS TDA9818 TDA9818T TDA9818TS SO24 SSOP24 SDIP24 SO24 SSOP24 DESCRIPTION
TDA9817; TDA9818
* AC-coupled limiter amplifier for sound intercarrier signal * Alignment-free FM Phase-Locked Loop (PLL) demodulator with high linearity * Sound IF (SIF) input for single reference Quasi Split Sound (QSS) mode (PLL controlled); SIF AGC detector for gain controlled SIF amplifier; single reference QSS mixer able to operate in high performance single reference QSS mode and in intercarrier mode * AM demodulator without extra reference circuit * Stabilizer circuit for ripple rejection and to achieve constant output signals * ElectroStatic Discharge (ESD) protection for all pins. GENERAL DESCRIPTION The TDA9817 is an integrated circuit for single standard vision IF signal processing and FM demodulation. The TDA9818 is an integrated circuit for multistandard vision IF signal processing, sound AM and FM demodulation.
VERSION SOT137-1 SOT340-1 SOT234-1 SOT137-1 SOT340-1
plastic small outline package; 24 leads; body width 7.5 mm plastic shrink small outline package; 24 leads; body width 5.3 mm plastic shrink dual in-line package; 24 leads (400 mil) plastic small outline package; 24 leads; body width 7.5 mm plastic shrink small outline package; 24 leads; body width 5.3 mm
2004 Jun 29
2
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
QUICK REFERENCE DATA SYMBOL VP IP Vi(VIF)(rms) PARAMETER supply voltage supply current vision IF input signal voltage sensitivity -1 dB video at output (RMS value) CONDITIONS
TDA9817; TDA9818
MIN. 4.5 76 - 0.97
TYP. 5 90 60 1.1 8 60 64 64 40 50 0.5 0.45 0.5
MAX. UNIT 5.5 104 100 1.23 - - - - - 100 0.6 0.54 0.6 V mA V V MHz dB dB dB dB V V V V
Vo(CVBS)(p-p) video output signal voltage (peak-to-peak value) Bv(-3dB) S/NW IM(1.1) IM(3.3) H(sup) Vi(SIF)(rms) Vo(FM)(rms) -3 dB video bandwidth on pin CVBS weighted signal-to-noise ratio for video intermodulation attenuation at `blue' intermodulation attenuation at `blue' suppression of video signal harmonics sound IF input signal voltage sensitivity (RMS value) audio output signal voltage for FM (RMS value) -3 dB at intercarrier output B/G standard; 27 kHz, 54% modulation M/N standard; 25 kHz modulation Vo(AM)(rms) THDaudio audio output signal voltage for AM (RMS value) total harmonic distortion audio signal FM AM S/NW(audio) weighted signal-to-noise ratio audio signal FM AM 54% modulation L standard; 54% modulation 54% modulation f = 1.1 MHz f = 3.3 MHz B/G and L standard; CL < 50 pF; RL > 1 k; AC load
7 56 58 58 35 - 0.4 0.36 0.4
- -
0.2 0.5
0.5 1.0
% %
55 47
60 53
- -
dB dB
2004 Jun 29
3
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L/L accent switch and adjust 2 x fpc TOP 22 TAGC 14 TUNER AGC CBL 15(1) VIF AGC AFC DETECTOR VIF1 1 VIF SAW VIF2 2 VIF AMPLIFIER FPLL VCO TWD VIDEO DEMODULATOR AND AMPLIFIER 16 CVBS CVAGC 4 TPLL 6 LADJ VCO2 7(1) 19 VCO1 18 AFC 17 VP 21 GND 20 VOLTAGE REFERENCE SOUND video TRAP 1 V (p-p) SIF1 23 SIF SAW SIF2 24 SIF AMPLIFIER QSS MIXER INTERCARRIER MIXER AM DEMODULATOR 1.1 V (p-p) 8 AF audio
BLOCK DIAGRAM
Philips Semiconductors
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
(1) Not connected for TDA9817T and TDA9817TS.
Fig.1 Block diagram.
handbook, full pagewidth
4
intercarrier mode
SIF AGC 5
INTERCARRIER MODE SWITCH 3(1) STD
TDA9817 TDA9818
12 QSS 5.5 MHz 13 FMin
FM-PLL DEMODULATOR 9 Vde-em 10 Cde-em 11 CDEC
MHA663
TDA9817; TDA9818
CSAGC
Product specification
standards selection switch
mute switch
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
PINNING SYMBOL VIF1 VIF2 STD CVAGC CSAGC TPLL LADJ AF Vde-em Cde-em CDEC QSS FMin TAGC CBL CVBS AFC VCO1 VCO2 GND VP TOP SIF1 SIF2 Note 1. Not connected for TDA9817T and TDA9817TS. PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION VIF differential input signal voltage 1 VIF differential input signal voltage 2 standards selection switch; note 1 VIF AGC capacitor SIF AGC capacitor PLL filter L/L accent switch and adjust; note 1 audio output de-emphasis output de-emphasis input decoupling capacitor single reference QSS/intercarrier output voltage sound intercarrier input voltage tuner AGC output black level detector; note 1 composite video output voltage AFC output VCO1 resonance circuit VCO2 resonance circuit ground supply voltage tuner AGC takeover point adjust SIF differential input signal voltage 1 SIF differential input signal voltage 2
VIF1 VIF2 STD CVAGC CSAGC TPLL LADJ AF Vde-em 1 2 3 4 5 6 7 8 9
TDA9817; TDA9818
24 SIF2 23 SIF1 22 TOP 21 VP 20 GND 19 VCO2 18 VCO1 17 AFC 16 CVBS 15 CBL 14 TAGC 13 FMin
mha664
TDA9818
Cde-em 10 CDEC 11 QSS 12
Fig.2 Pin configuration SDIP24.
2004 Jun 29
5
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9817; TDA9818
handbook, halfpage
handbook, halfpage
VIF1 VIF2 STD(1) CVAGC CSAGC TPLL LADJ(1) AF Vde-em
1 2 3 4 5 6 7 8 9
24 SIF2 23 SIF1 22 TOP 21 VP 20 GND
VIF1 VIF2 STD(1) CVAGC CSAGC TPLL LADJ(1) AF Vde-em
1 2 3 4 5 6
24 SIF2 23 SIF1 22 TOP 21 VP 20 GND 19 VCO2
TDA9818T TDA9817T 18 VCO1
17 AFC 16 CVBS 15 CBL
(1)
19 VCO2
TDA9818TS 7 TDA9817TS 18 VCO1
8 9 17 AFC 16 CVBS 15 CBL(1) 14 TAGC 13 FMin
MGU398
Cde-em 10 CDEC 11 QSS 12
MGU397
Cde-em 10 CDEC 11 QSS 12
14 TAGC 13 FMin
(1) Not connected for TDA9817T.
(1) Not connected for TDA9817TS.
Fig.3 Pin configuration SO24.
Fig.4 Pin configuration SSOP24.
2004 Jun 29
6
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
FUNCTIONAL DESCRIPTION The integrated circuit comprises the functional blocks as shown in Fig.1: * Vision IF amplifier and VIF AGC detector * Tuner AGC * Frequency Phase Locked Loop detector (FPLL) * VCO, Travelling Wave Divider (TWD) and AFC * Video demodulator and amplifier * Sound IF amplifier and SIF AGC * Single reference QSS mixer * AM demodulator * FM-PLL demodulator * Audio Frequency (AF) signal processing * Internal voltage stabilizer. Vision IF amplifier and VIF AGC detector The vision IF amplifier consists of three AC-coupled differential amplifier stages. Each differential stage comprises a feedback network controlled by emitter degeneration. The AGC detector generates the required VIF gain control voltage for constant video output by charging/discharging the AGC capacitor. Therefore for negative video modulation the sync level and for positive video modulation the peak white level of the video signal is detected. In order to reduce the reaction time for positive modulation, where a very large time constant is needed, an additional level detector increases the discharging current of the AGC capacitor (fast mode) in the event of a decreasing VIF amplitude step. The additional level information is given by the black-level detector voltage. Tuner AGC The AGC capacitor voltage is converted to an internal IF control signal, and is fed to the tuner AGC to generate the tuner AGC output current at pin TAGC (open-collector output). The tuner AGC takeover point can be adjusted at pin TADJ. This allows to match the tuner to the SAW filter in order to achieve the optimum IF input level. Frequency Phase Locked Loop detector (FPLL) The VIF-amplifier output signal is fed into a frequency detector and into a phase detector via a limiting amplifier. During acquisition the frequency detector produces a DC current proportional to the frequency difference between the input and the VCO signal. After frequency lock-in the phase detector produces a DC current 2004 Jun 29 7
TDA9817; TDA9818
proportional to the phase difference between the VCO and the input signal. The DC current of either frequency detector or phase detector is converted into a DC voltage via the loop filter, which controls the VCO frequency. In the event of positive modulated signals the phase detector is gated by composite sync in order to avoid signal distortion for overmodulated VIF signals. VCO, Travelling Wave Divider (TWD) and AFC The VCO operates with a resonance circuit (with L and C in parallel) at double the picture carrier frequency. The VCO is controlled by two integrated variable capacitors. The control voltage required to tune the VCO from its free-running frequency to actually double the picture carrier frequency is generated by the frequency-phase detector (FPLL) and fed via the loop filter to the first variable capacitor. This control voltage is amplified and additionally converted into a current which represents the AFC output signal. At centre frequency the AFC output current is equal to zero. For TDA9818: the VCO centre frequency can be decreased (required for L accent standard) by activating an additional internal capacitor. This is achieved by using the L accent switch. In this event the second variable capacitor can be controlled by a variable resistor at the L accent switch for setting the VCO centre frequency to the required L accent value. The oscillator signal is divided by 2 with a TWD which generates two differential output signals with a 90 degree phase difference independent of the frequency. Video demodulator and amplifier The video demodulator is realized by a multiplier which is designed for low distortion and large bandwidth. The vision IF input signal is multiplied with the `in phase' signal of the travelling wave divider output. In the demodulator stage the video signal polarity can be switched in accordance with the TV standard. The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the video amplifier. The video amplifier is realized by an operational amplifier with internal feedback and high bandwidth. A low-pass filter is integrated to achieve an attenuation of the carrier harmonics for B/G and L standard. The standard dependent level shift in this stage delivers the same sync level for positive and negative modulation. The video output signal at pin CVBS is 1.1 V (p-p) for nominal vision IF modulation, in order to achieve 1 V (p-p) at sound trap output.
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
Sound IF amplifier and SIF AGC The sound IF amplifier consists of two AC-coupled differential amplifier stages. Each differential stage comprises a controlled feedback network provided by emitter degeneration. The SIF AGC detector is related to the SIF input signal (average level of AM or FM carrier) and controls the SIF amplifier to provide a constant SIF signal to the AM demodulator and single reference QSS mixer. At L standard (AM sound) the SIF AGC reaction time is set to `slow' for nominal video conditions. But with a decreasing VIF amplitude step the SIF AGC is set to `fast' mode controlled by the VIF AGC detector. In FM mode this reaction time is always `fast'. Single reference QSS mixer The single reference QSS mixer is realized by a multiplier. The SIF amplifier output signal is fed to the single reference QSS mixer and converted to intercarrier frequency by the regenerated picture carrier (VCO). The mixer output signal is fed via a high-pass for attenuation of the video signal components to the output pin QSS. With this system a high performance hi-fi stereo sound processing can be achieved. For a simplified application without a sound IF SAW filter the single reference QSS mixer can be switched to the intercarrier mode by connecting pin SIF2 to ground. In this mode the sound IF passes the vision IF SAW filter and the composite IF signal is fed to the single reference QSS mixer. This IF signal is multiplied with the 90 degree TWD output signal for converting the sound IF to intercarrier frequency. This composite intercarrier signal is fed to the output pin QSS, too. By using this quadrature detection, the low frequency video signals are removed. AM demodulator The AM demodulator is realized by a multiplier. The modulated SIF amplifier output signal is multiplied in phase with the limited (AM is removed) SIF amplifier output signal. The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the AF amplifier. FM-PLL demodulator
TDA9817; TDA9818
The FM-PLL demodulator consists of a limiter and an FM-PLL. The limiter provides the amplification and limitation of the FM sound intercarrier signal. The result is high sensitivity and AM suppression. The amplifier consists of 7 stages which are internally AC-coupled in order to minimize the DC offset. Furthermore the AF output signal can be muted by connecting a resistor between the limiter input pin FMin and ground. The FM-PLL consists of an integrated relaxation oscillator, an integrated loop filter and a phase detector. The oscillator is locked to the FM intercarrier signal, output from the limiter. As a result of locking, the oscillator frequency tracks with the modulation of the input signal and the oscillator control voltage is superimposed by the AF voltage. The FM-PLL operates as an FM demodulator. Audio Frequency signal processing The AF amplifier consists of two parts: 1. The AF pre-amplifier for FM sound is an operational amplifier with internal feedback, high gain and high common mode rejection. The AF voltage from the PLL demodulator, by principle a small output signal, is amplified by approximately 33 dB. The low-pass characteristic of the amplifier reduces the harmonics of the intercarrier signal at the sound output terminal pin Vde-em at which the de-emphasis network for FM sound is applied. An additional DC control circuit is implemented to keep the DC level constant, independent of process spread. 2. The AF output amplifier (10 dB) provides the required output level by a rail-to-rail output stage. This amplifier makes use of an input selector for switching to AM, FM de-emphasis or mute state, controlled by the standard switching voltage and the mute switching voltage. Internal voltage stabilizer The bandgap circuit internally generates a voltage of approximately 1.25 V, independent of supply voltage and temperature. A voltage regulator circuit, connected to this voltage, produces a constant voltage of 3.6 V which is used as an internal reference voltage.
2004 Jun 29
8
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP supply voltage PARAMETER CONDITIONS TDA9817T, TDA9818 and TDA9818T: maximum chip temperature of 120 C; note 1 TDA9817TS and TDA9818TS: maximum chip temperature of 130 C; note 1 Vn voltage at pins VIF1, VIF2, STD, CVAGC, CSAGC, TPLL, Vde-em, Cde-em, CDEC, FMin, TAGC, CBL, AFC, VP, TOP, SIF1 and SIF2 maximum short-circuit time to ground or VP tuner automatic gain control output voltage storage temperature ambient temperature electrostatic handling voltage note 2
TDA9817; TDA9818
MIN. -
MAX. 5.5 V
UNIT
-
5.5
V
0
VP
V
tsc(max) VTAGC Tstg Tamb Vesd Notes
- 0 -25 -20 -300
10 13.2 +150 +70 +300
s V C C V
1. IP = 104 mA; Tamb = 70 C; Rth(j-a) = 65 K/W for TDA9818, Rth(j-a) = 85 K/W for TDA9817T and TDA9818T, Rth(j-a) = 110 K/W for TDA9817TS and TDA9818TS. 2. Machine model class B (L = 2.5 H). THERMAL CHARACTERISTICS SYMBOL Rth(j-a) TDA9818 TDA9817T; TDA9818T TDA9817TS; TDA9818TS PARAMETER CONDITIONS VALUE 65 85 110 UNIT K/W K/W K/W
thermal resistance from junction to ambient in free air
2004 Jun 29
9
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9817; TDA9818
CHARACTERISTICS VP = 5 V; Tamb = 25 C; see Table 1 for input frequencies and levels; input level Vi(VIF)(rms) = 10 mV (sync level for B/G, peak white level for L); IF input from 50 via broadband transformer 1 : 1; video modulation DSB; residual carrier B/G: 10%; L = 3%; video signal in accordance with "CCIR, line 17" or "NTC-7 Composite"; measurements taken in Fig.15; unless otherwise specified. SYMBOL Supply (pin VP) VP IP Vi(VIF)(rms) Vi(VIF)(max)(rms) V(IF)(int) supply voltage supply current B/G standard; -1 dB video at output B/G standard; 1 dB video at output note 1 4.5 76 - 120 - 5 90 5.5 104 V mA V mV dB PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Vision IF amplifier (pins VIF1 and VIF2) input signal voltage sensitivity (RMS value) maximum input signal voltage (RMS value) 60 200 0.7 100 - 1
internal IF amplitude within AGC range; difference between picture B/G standard; and sound carrier f = 5.5 MHz IF gain control range differential input capacitance DC input voltage see Fig.5 note 2 note 2 differential input resistance note 2
GIF(ctrl) Ri(dif) Ci(dif) VI(VIF) fVCO(max)
65 1.7 1.2 - 125
70 2.2 1.7 3.4
- 2.7 2.5 - -
dB k pF V
True synchronous video demodulator; note 3 maximum oscillator frequency for carrier regeneration f = 2fpc 130 MHz
fosc/T fosc/VP VVCO(rms)
oscillator drift as a function oscillator is free-running; of temperature IAFC = 0; note 4 oscillator shift as a function of supply voltage oscillator voltage swing at pins VCO1 and VCO2 (RMS value) picture carrier capture range B/G, M/N and L standard L accent standard; fpc = 33.9 MHz; RLADJ = 5.6 k L accent standard; fpc = 33.9 MHz; RLADJ = 5.6 k oscillator is free-running; note 4
- - 50
- - 80
20 x 10-6
K-1
1.5 x 10-3 V-1 110 mV
fcr(pc)
1.4 0.9
1.8 1.2
- -
MHz MHz
fpc(fr)
picture carrier frequency (free-running) accuracy L accent alignment frequency range acquisition time
-
200
400
kHz
falgn(Laccent) tacq
L accent standard; IAFC = 0 400 BL = 70 kHz; note 5 -
600 -
- 30
kHz ms
2004 Jun 29
10
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
SYMBOL Vi(VIF)(sens)(rms) PARAMETER VIF input signal voltage sensitivity for PLL to be locked (RMS value); pins VIF1 and VIF2 CONDITIONS maximum IF gain; note 6 - MIN.
TDA9817; TDA9818
TYP. 30 70
MAX.
UNIT V
Composite video amplifier (pin CVBS); sound carrier off Vo(CVBS)(p-p) V/S output signal voltage (peak-to-peak value) ratio between video (black-to-white) and sync level output signal voltage difference sync voltage level upper video clipping voltage level lower video clipping voltage level output resistance internal DC bias current for emitter-follower maximum AC and DC output sink current maximum AC and DC output source current deviation of CVBS output signal voltage at B/G standard black level tilt in B/G standard vertical black level tilt for worst case in L standard differential gain differential phase -1 dB video bandwidth 50 dB gain control 30 dB gain control gain variation; note 7 note 2 difference between B/G and L standard B/G and L standard see Fig.10 0.97 1.9 1.1 2.33 1.23 3.0 V
Vo(CVBS) Vsync Vclip(u) Vclip(l) Ro Ibias(int) Io(sink)(max) Io(source)(max) Vo(CVBS)(B/G)
- 1.4 VP - 1.1 - - 2.2 1.6 2.9 - - -
- 1.5 VP - 1 0.7 - 3.0 - - - - - -
12 1.6 - 0.9 10 - - - 0.5 0.1 1 1.9
% V V V mA mA mA dB dB % %
Vo(BL)(B/G) Vo(BL)(L)
vision carrier modulated by - test line (VITS) only; gain variation; note 7
Gdif dif Bv(-1dB)
"CCIR, line 330" "CCIR, line 330"
B/G and L standard; CL < 50 pF; RL > 1 k; AC load B/G and L standard; CL < 50 pF; RL > 1 k; AC load see Fig.7; note 8
- - 5
2 1 6
5 2 -
% deg MHz
Bv(-3dB)
-3 dB video bandwidth
7
8
-
MHz
S/NW S/N
weighted signal-to-noise ratio
56 49
60 53
- -
dB dB
unweighted signal-to-noise see Fig.7; note 8 ratio
2004 Jun 29
11
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
SYMBOL IM(1.1) PARAMETER intermodulation attenuation at `blue' intermodulation attenuation at `yellow' IM(3.3) intermodulation attenuation at `blue' intermodulation attenuation at `yellow' funwanted(p-p) robustness for unwanted frequency deviation of picture carrier (peak-to-peak value) robustness for modulator imbalance CONDITIONS f = 1.1 MHz; see Fig.8; note 9 f = 1.1 MHz; see Fig.8; note 9 f = 3.3 MHz; see Fig.8; note 9 f = 3.3 MHz; see Fig.8; note 9 L standard; residual carrier: 3%; serration pulses: 50%; note 2 L standard; residual carrier: 0%; serration pulses: 50%; note 2 fundamental wave and harmonics; B/G and L standard note 10a note 10b video signal; grey level; see Fig.13 B/G standard L standard VIF AGC detector (pins CVAGC and CBL) Ich charging current B/G and L standard; note 7 0.75 1.9 30 26 MIN. 58 60 58 59 -
TDA9817; TDA9818
TYP. 64 66 64 65 - - - - - 12
MAX.
UNIT dB dB dB dB kHz
-
-
3
%
vc(rms)
residual vision carrier (RMS value) suppression of video signal harmonics spurious elements power supply ripple rejection at pin CVBS
-
2
5
mV
H(sup) H(spur) PSRR
35 40
40 -
- -
dB dB
35 30
- -
dB dB
1 2.5
1.25 3.1
mA A
additional charging current L standard in event of missing VITS pulses and no white video content Idch discharging current B/G standard normal mode L fast mode L tresp(inc) tresp(dec) AGC response to an increasing VIF step AGC response to a decreasing VIF step B/G and L standard; note 11 B/G standard fast mode L normal mode L; note 11 IF Vth(CBL) VIF amplitude step for activating fast AGC mode L standard
15 225 30 - - - - -2
20 300 40 0.05 2.2 1.1 150 -6
25 375 50 0.1 3.5 1.8 240 -10
A nA A ms/dB ms/dB ms/dB ms/dB dB
threshold voltage level see Fig.10 additional charging current L standard L standard; fast mode L
1.95 1.6
2.0 1.66
2.05 1.72
V V
2004 Jun 29
12
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
SYMBOL PARAMETER CONDITIONS - MIN.
TDA9817; TDA9818
TYP.
MAX.
UNIT
Tuner AGC (pin TAGC) Vi(rms) IF input signal voltage for minimum starting point of tuner takeover (RMS value) IF input signal voltage for maximum starting point of tuner takeover (RMS value) Vo(TAGC) Vsat(TAGC) permissible output voltage saturation voltage input at pins VIF1 and VIF2; RTOP = 22 k; ITAGC = 0.4 mA input at pins VIF1 and VIF2; RTOP = 0 ; ITAGC = 0.4 mA from external source; note 2 ITAGC = 1.5 mA ITAGC = 0.4 mA see Fig.5 no tuner gain reduction; VTAGC = 13.2 V maximum tuner gain reduction GIF IF slip by automatic gain control tuner gain current from 20% to 80% - 1.5 - - 2 6 5 2.6 8 A mA dB 2 5 mV
50
100
-
mV
- - -
- - 0.03
13.2 0.2 0.07
V V dB/K
VTOP(TAGC)/T variation of takeover point by temperature ITAGC(sink) sink current
AFC circuit (pin AFC); see Fig.9; note 12 CRstps control steepness IAFC/f note 13 33.9 MHz 38.9 MHz 45.75 MHz 58.75 MHz fIF/T frequency variation by temperature B/G and L standard; IAFC = 0; note 4 L accent standard; IAFC = 0; note 4 Vo(AFC) Io(source)(AFC) Io(sink)(AFC) IAFC(p-p) output voltage output source current output sink current residual video modulation current (peak-to-peak value) B/G and L standard upper limit lower limit 0.5 0.5 0.45 0.38 - - 0.75 0.75 0.65 0.55 - - 1.0 1.0 0.85 0.72 20 x 10-6 A/kHz A/kHz A/kHz A/kHz K-1 K-1 V V A A A
60 x 10-6
VP - 0.6 VP - 0.3 - - 150 150 - 0.3 200 200 20 0.6 250 250 30
2004 Jun 29
13
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
SYMBOL PARAMETER CONDITIONS FM mode; -3 dB at - intercarrier output pin QSS AM mode; -3 dB at AF output pin AF Vi(max)(rms) maximum input signal voltage (RMS value) - MIN.
TDA9817; TDA9818
TYP.
MAX.
UNIT V V mV mV dB k pF V dB
Sound IF amplifier (pins SIF1 and SIF2) Vi(SIF)(rms) input signal voltage sensitivity (RMS value) 50 50 100 100 66 2.2 1.7 3.4 - 100 100 - - - 2.7 2.5 - -
FM mode; 1 dB at 65 intercarrier output pin QSS AM mode; 1 dB at AF output pin AF 65 60 1.7 1.2 - between pins VIF1 and VIF2, and pins SIF1 and SIF2; note 14 50
GSIF(ctrl) Ri(dif) Ci(dif) VI(SIF) SIF,VIF
SIF gain control range
FM and AM mode; see Fig.6 note 2
differential input resistance note 2 differential input capacitance DC input voltage crosstalk attenuation between SIF and VIF inputs
SIF AGC detector (pin CSAGC) Ich(CSAGC) Idch(CSAGC) charging current discharging current FM mode AM mode FM mode normal mode AM fast mode AM Single reference QSS intercarrier mixer (B/G standard; pin QSS) Vo(rms) IF intercarrier output level (RMS value) QSS mode; sound carrier 1; sound carrier 2 off L standard; without modulation intercarrier mode; sound carrier 1; sound carrier 2 off Vo(peak) IF intercarrier output level (peak value) -3 dB intercarrier bandwidth residual sound carrier (RMS value) QSS mode L standard; 80% AM modulation upper limit QSS mode; fundamental wave and harmonics intercarrier mode; fundamental wave and harmonics 100 140 180 mV 8 0.8 8 1 60 12 1.2 12 1.4 85 16 1.6 16 1.8 110 A A A A A
100 -
140 note 15
180 -
mV mV
141 255 7.5 - -
198 356 9 2 2
225 458 - 5 5
mV mV MHz mV mV
Bs(-3dB) sc(rms)
2004 Jun 29
14
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
SYMBOL vc(rms) PARAMETER residual vision carrier (RMS value) CONDITIONS QSS mode; fundamental wave and harmonics intercarrier mode; fundamental wave and harmonics H(sup) Ro(QSS) VO(QSS) Iint(QSS) Isink(max)(QSS) Isource(max)(QSS) suppression of video signal harmonics output resistance DC output voltage DC internal bias current for emitter follower maximum AC and DC output sink current maximum AC and DC output source current intercarrier mode; fvideo 5 MHz note 2 - - MIN.
TDA9817; TDA9818
TYP. 2 5 5 20
MAX.
UNIT mV mV
39 - - 1.9 1.4 3.0
- - 2.0 2.5 1.9 3.5
- 25 - - - -
dB V mA mA mA
Limiter amplifier (pin FMin); note 16 Vi(FMin)(rms) Vi(FMin)(rms) input signal voltage for lock-in (RMS value) input signal voltage (RMS value) S + N weighted ------------- N = 40 dB allowed input signal voltage (RMS value) AM AM suppression 50 s de-emphasis; AM: f = 1 kHz; m = 0.3 refer to 27 kHz (54% FM deviation) note 2 200 46 - 50 - - mV dB - - - 250 100 400 V V
Ri(FMin) VI(FMin) fcr fhr tacq
input resistance DC input voltage
480 -
600 2.8 - - - - -
720 - - 4.0 - 3.5 4
V
FM-PLL demodulator catching range of PLL holding range of PLL acquisition time upper limit lower limit upper limit lower limit 7.0 - 9.0 - - MHz MHz MHz MHz s
2004 Jun 29
15
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
SYMBOL PARAMETER CONDITIONS MIN.
TDA9817; TDA9818
TYP.
MAX.
UNIT
FM operation (B/G standard; pin AF); notes 16 and 16a Vo(AF)(rms) AF output signal voltage (RMS value) 27 kHz (54% FM deviation); see Fig.15; note 17 Rx = 470 Rx = 0 25 kHz (50% FM deviation); Rx = 0 ; see Fig.15; note 17 Vo(AF)(clip) fAF Vo/T Vde-em(DC) RAF VAF Isink(max)(AF) Isource(max)(AF) BAF(-3dB) THD S/NW AF output clipping signal voltage level frequency deviation temperature drift of AF output signal voltage DC voltage at decoupling capacitor output resistance DC output voltage maximum AC and DC output sink current maximum AC and DC output source current -3 dB audio frequency bandwidth total harmonic distortion weighted signal-to-noise ratio without de-emphasis capacitor 27 kHz (54% FM deviation) FM-PLL only; with 50 s de-emphasis; 27 kHz (54% FM deviation); "CCIR 468-4" fundamental wave and harmonics B/G and L standard FM-PLL in lock mode THD < 1.5% THD < 1.5%; note 17 200 400 360 250 500 450 300 600 540 mV mV mV
1.0 - -
- - 3 x 10-3 - - 2.3 - - 125 0.2 60
1.2 53 7 x 10-3 3.0 100 - 0.5 0.5 - 0.5 -
V kHz dB/K V V mA mA kHz % dB
voltage dependent on VCO 1.2 frequency; note 18 note 2 - - - - 100 - 55
sc(rms) AF VAF
residual sound carrier (RMS value) mute attenuation of AF signal DC jump voltage of AF output terminal for switching AF output to mute state and vice versa power supply ripple rejection at pin AF
- 70 -
- 75 50
75 - 150
mV dB mV
PSRR
Rx = 0 ; f = 70 Hz; see Figs 13 and 15
20
26
-
dB
2004 Jun 29
16
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
SYMBOL PARAMETER CONDITIONS MIN.
TDA9817; TDA9818
TYP. - -
MAX.
UNIT
Single reference QSS AF performance for FM operation (B/G standard); see Table 1; notes 19, 20 and 21 S/NW weighted signal-to-noise ratio pc/sc1 ratio at pins VIF1 and VIF2; 27 kHz (54% FM deviation); "CCIR 468-4" black picture white picture 6 kHz sine wave (black-to-white modulation) sound carrier subharmonics; f = 2.75 MHz 3 kHz S/NW weighted signal-to-noise ratio 40 dB
53 50 42
58 55 48
- - -
dB dB dB
45
51
-
dB
Intercarrier AF performance for FM operation (standard B/G); see Table 1; notes 19, 20 and 22 pc/sc1 ratio at pins VIF1 27 and VIF2; 27 kHz (54% FM deviation); "CCIR 468-4" black picture white picture 6 kHz sine wave (black-to-white modulation) sound carrier subharmonics; f = 2.75 MHz 3 kHz AM operation (L standard; pin AF); note 23 Vo(AF)(rms) THD BAF(-3dB) S/NW VAF PSRR AF output signal voltage (RMS value) total harmonic distortion -3 dB AF bandwidth weighted signal-to-noise ratio DC potential voltage power supply ripple rejection at pin AF see Fig.13 54% modulation 54% modulation 400 - 100 47 - 20 500 0.5 125 53 2.3 26 600 1.0 - - - - mV % kHz dB V dB 47 47 40 - - dB
51 51 46
- - -
dB dB dB
35
39
-
dB
"CCIR 468-4"
Switching level for standard switch (pin STD) Vlogic DC potential for logic B/G standard HIGH or pin not connected DC potential for logic LOW L/L accent standard IIL LOW level input current Vi = 0 V 2.8 0 190 - - 250 VP 0.8 310 V V A
2004 Jun 29
17
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
Notes 1. Values of video and sound parameters are decreased at VP = 4.5 V.
TDA9817; TDA9818
2. This parameter is not tested during production and is only given as an application information for designing the television receiver. 3. Loop bandwidth BL = 70 kHz (natural frequency fn = 12 kHz; damping factor d 3; calculated with sync level within gain control range). Resonance circuit of VCO: Q0 > 50; Cext = 8.2 pF 0.25 pF; Cint 8.5 pF (loop voltage approximately 2.7 V). 4. Temperature coefficient of external LC circuit is equal to zero. 5. Vi(VIF)(rms) = 10 mV; f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture video modulation. 6. VIF signal for nominal video signal. 7. The leakage current of the AGC capacitor should not exceed 1 A at B/G standard, respectively 10 nA current at L standard. Larger currents will increase the tilt. 8. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin CVBS). B = 5 MHz weighted in accordance with "CCIR 567". 9. The intermodulation figures are defined: V o at 4.4 MHz 1.1 = 20 log ------------------------------------- + 3.6 dB ; 1.1 value at 1.1 MHz referenced to black/white signal; V o at 1.1 MHz V o at 4.4 MHz 3.3 = 20 log ------------------------------------- ; 3.3 value at 3.3 MHz referenced to colour carrier. V o at 3.3 MHz 10. Measurements taken with SAW filter K3953 (sound carrier suppression: 40 dB); loop bandwidth BL = 70 kHz: a) Modulation VSB; sound carrier off; fvideo > 0.5 MHz. b) Sound carrier on; SIF SAW filter K9453; fvideo = 10 kHz to 10 MHz. 11. Response speed valid for a VIF input level range of 200 V up to 70 mV. 12. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is given in Fig.9. The AFC-steepness can be changed by the resistors at pin AFC. 13. Depending on the ratio C/C0 of the LC resonant circuit of VCO (Q0 > 50; note 3; C0 = Cint + Cext). 14. Source impedance: 2.3 k in parallel to 12 pF (SAW filter); fIF = 38.9 MHz. 15. Without using an SIF SAW filter the mixer can be switched to intercarrier mode by connecting pin SIF1 and/or pin SIF2 to ground. In this mode the SIF passes the VIF SAW filter and IF intercarrier levels are depending on the sound shelf of the VIF SAW filter. The intercarrier output signal at pin QSS can be calculated by the following formula taking into account the video output signal at pin CVBS (Vo(CVBS)(p-p) = 1.1 V typical) as a reference:
V i(sc) ------------ ( dB ) + 6 dB 3 dB V i(pc) ------------------------------------------------------------20
1 V o(rms) = 1.1 V ( p - p ) x ---------- x 10 22
where:
1 a) ---------- = correction term for RMS value 22 V i(sc) b) ------------- (dB) = sound-to-picture carrier ratio at VIF inputs in dB V i(pc) c) 6 dB = correction term of internal circuitry d) 3 dB = tolerance of video output and intercarrier output amplitude Vo(rms)
2004 Jun 29
18
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
e) Example for SAW filter G1962: sound shelf value = 20 dB, V i(sc) ------------- = - 27 dB V o(rms) = 32 mV (typical value) V i(pc)
TDA9817; TDA9818
16. Input level for second IF from an external generator with 50 source impedance. AC-coupled with 10 nF capacitor, fmod = 1 kHz, 27 kHz (54% FM deviation) of audio references. A VIF/SIF input signal is not permitted. Pins CVAGC and CSAGC have to be connected to positive supply voltage for minimum IF gain. S/N and THD measurements are taken at 50 s de-emphasis at pin Vde-em (modulator pre-emphasis has to be activated). The FM demodulator steepness Vo(AF)/fAF is positive. a) Second IF input level 10 mV (RMS value). 17. Measured with an FM deviation of 27 kHz the typical AF output signal is 500 mV (RMS) (Rx = 0 ). By using Rx = 470 the AF output signal is attenuated by 6 dB [250 mV (RMS)]. For handling a frequency deviation of more than 53 kHz the AF output signal has to be reduced by using Rx in order to avoid clipping (THD < 1.5%). For an FM deviation up to 100 kHz an attenuation of 6 dB is recommended with Rx = 470 . 18. The leakage current of the decoupling capacitor (2.2 F) should not exceed 1 A. 19. For all S/N measurements the used vision IF modulator has to meet the following specifications: a) Incidental phase modulation for black-to-white jump less than 0.5 degrees b) QSS AF performance, measured with the television demodulator AMF2 (audio output, weighted S/N ratio) better than 60 dB (deviation 27 kHz) for 6 kHz sine wave black-to-white video modulation c) Picture-to-sound carrier ratio; pc/sc1 = 13 dB (transmitter). 20. The pc/sc1 ratio is calculated as the addition of TV transmitter pc/sc1 ratio and SAW filter pc/sc1 ratio. This pc/sc1 ratio is necessary to achieve the S/NW values as noted. A different pc/sc1 ratio will change these values. 21. Measurements taken with SAW filter K3953 for vision IF (suppressed sound carrier) and K9453 for sound IF (suppressed picture carrier). Input level Vi(SIF)(rms) = 10 mV, 27 kHz (54% FM deviation). 22. Measurements taken with SAW filter G1962 (sound shelf: 20 dB) for vision and sound IF. Pin SIF1 and/or pin SIF2 has to be connected to ground for switching the single reference QSS mixer to intercarrier mode. 23. Measurements taken with SAW filter K9453 (Siemens) for AM sound IF (suppressed picture carrier). Table 1 Input frequencies and carrier ratios SYMBOL fpc or fIF fsc1 fsc2 picture-to-sound carrier sc1 sc2 B/G STANDARD 38.9 33.4 33.158 13 20 M/N STANDARD 45.75/58.75 41.25/54.25 - 7 - L STANDARD 38.9 32.4 - 10 - L ACCENT STANDARD 33.9 40.4 - 10 - UNIT MHz MHz MHz dB dB
DESCRIPTION picture or IF carrier sound carrier
2004 Jun 29
19
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9817; TDA9818
handbook, full pagewidth gain
70
MHA665
0.06
(dB) 60 Ituner (mA) 0
Vi(VIF)(rms) (mV) 0.6
50
40
30
(1) (2) (3) (4)
6
20
1
10
60
0 2 -10 1 1.5 2 2.5 3 3.5 4 4.5
VCVAGC (V)
(1) Ituner; RTOP = 22 k. (2) Gain.
(3) Ituner; RTOP = 11 k. (4) Ituner; RTOP = 0 .
Fig.5 Typical VIF and tuner AGC characteristics.
handbook, full pagewidth
110
MHA666
100
(dBV) 100 90 80 70
Vi(SIF)(rms) (mV) 10
1
60 50
0.1
40 30
0.01
20 1 1.5 2 2.5 3 3.5 4 VCSAGC (V) 4.5
Fig.6 Typical SIF AGC characteristic (FM and AM mode).
2004 Jun 29
20
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9817; TDA9818
handbook, halfpage
75
MED684
S/N (dB)
50
25
0 -60 0.06
-40 0.6
-20 6 10
0
20
Vi(VIF)(rms)(dB) 60 600 Vi(VIF)(rms)(mV)
Fig.7 Typical signal-to-noise ratio as a function of IF input voltage.
handbook, halfpage
3.2 dB 10 dB 13.2 dB 27 dB
13.2 dB 27 dB
sc cc
pc
sc cc
pc
BLUE
YELLOW
MED685
sc = sound carrier, with respect to sync level. cc = chrominance carrier, with respect to sync level. pc = picture carrier, with respect to sync level. The sound carrier levels are taking into account a sound shelf attenuation of 20 dB (SAW filter G1962).
Fig.8 Input signal conditions.
2004 Jun 29
21
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9817; TDA9818
handbook, full pagewidth
VP
VP = 5 V
VAFC IAFC (V) (A) -200 -100 2.5 0 100 200
MHA667
22 k IAFC TDA9817 17 TDA9818 22 k 100 nF VAFC
(source current)
(sink current)
38.5
38.9
39.3 f (MHz)
Fig.9 Measurement conditions and typical AFC characteristic.
handbook, full pagewidth
2.6 V
white level
1.83 V 1.5 V
black level sync level
B/G and M/N standard 2.6 V white level
2.0 V 1.83 V 1.66 V 1.5 V
threshold level black level threshold level sync level
L standard
MHA668
Fig.10 Typical video signal levels on output pin CVBS (sound carrier off).
2004 Jun 29
22
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9817; TDA9818
handbook, halfpage
(1)
10
MHA669
handbook, halfpage
(1)
10
MHA670
1.6 THD (%) 1.2
(dB) -10
(dB) -10
(2)
-30
(3)
-30
0.8
(2)
-50
-50
(3)
0.4
-70 30 50 70 90 110 Vi (dBV)
-70 30 50 70
0 90 110 Vi (dBV)
(1) Signal. (2) AM rejection. (3) Noise.
(1) Signal. (2) THD. (3) Noise.
Fig.11 Typical audio level, noise and AM rejection (54% FM deviation) for FM.
Fig.12 Typical audio level, noise and THD (54% AM modulation) for AM.
handbook, full pagewidth
VP = 5 V VP = 5 V 100 mV (fripple = 70 Hz)
TDA9817 TDA9818
MHA671
t
Fig.13 Ripple rejection condition.
2004 Jun 29
23
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9817; TDA9818
handbook, full pagewidth
140 antenna input (dBV)
10 IF signals RMS value (V) video 1.1 V (p-p) 1
120
(1)
100
SAW insertion loss 14 dB IF slip 6 dB
10-1
80
tuning gain control range 70 dB VIF AGC
10-2 (TOP)
60
10-3 0.66 x 10-3 SAW insertion loss 14 dB
40 40 dB RF gain
10-4
20
10-5 0.66 x 10-5
10 VHF/UHF tuner tuner VIF SAW filter VIF amplifier, demodulator and video TDA9817; TDA9818
MHA672
(1) Depends on TOP.
Fig.14 Front end level diagram.
2004 Jun 29
24
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
INTERNAL CIRCUITRY Table 2 PIN NO. 1 2 Equivalent pin circuits and pin voltages PIN SYMBOL VIF1 VIF2 DC VOLTAGE (V) 3.4 3.4
1 1.1 k
TDA9817; TDA9818
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
+
650 A +
800 2
1.1 k
3.4 V
650 A
MHA673
3
STD(1)
0 to VP
3.6 V 26 k 3 3.6 V 16 k
24 k
MHA674
4
CVAGC
1.5 to 4.0
40 A
4 Ib
1 mA
2.5 A
0.3/20/40 A
MHA675
2004 Jun 29
25
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
PIN NO. 5 PIN SYMBOL CSAGC DC VOLTAGE (V) 1.5 to 4.0
TDA9817; TDA9818
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
+ 15 A
5 Ib + + +
1 A
MHA676
6
PLL
1.5 to 4.0
+
+
+
+
Ib 6
+
VCO 200 A
MHA677
7
LADJ(1)
0 to VP
+ 100 A 7.6 k + 7 17 k 3.6 V 9 k 100 A 9 k 7.2 k 1V 2.5 V
MHA678
2004 Jun 29
26
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
PIN NO. 8 PIN SYMBOL AF DC VOLTAGE (V) 2.3
21.7 k 8 25 pF 23.7 k
TDA9817; TDA9818
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
+ +
120
MHA679
9 10
Vde-em Cde-em
2.3 2.3
5.6 k + 8.4 k
10 pF 9 39 k 27.4 k 10 290 5.6 k + 8.4 k
3.5 k
MHA680
11
CDEC
1.2 to 3.0
+ +
+ 90 A
11
1 k
MHA681
2004 Jun 29
27
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
PIN NO. 12 PIN SYMBOL QSS DC VOLTAGE (V) 2.0
TDA9817; TDA9818
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
+ 150
1.9 mA 12 14.7 k
MHA682
13
FMin
2.65
13 640 400 40 k
2.65 V
35 A
600 A
MHA683
14
TAGC
0 to 13.2
14
MHA684
15
CBL(1)
0 to 3.2
5 A + 2.5 A 15 30 A
+
2.5 A + 0.15 A
+
+ + 16 A 10 A 10 A
2.5 A
MHA685
2004 Jun 29
28
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
PIN NO. 16 PIN SYMBOL CVBS DC VOLTAGE (V) sync level: 1.5
TDA9817; TDA9818
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
+ 100
2.1 pF 3.0 mA 16
MHA686
17
AFC
0.3 to VP - 0.3
+
+
17
IAFC 200 A
MHA687
18 19
VCO1 VCO2
2.7 2.7
18 B/G 2.8 V 420 420 50
+
+
20 k
20 k
L accent 19
500 A
MHA688
20 21
GND VP
0 VP
2004 Jun 29
29
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
PIN NO. 22 PIN SYMBOL TOP DC VOLTAGE (V) 0 to 1.9
30 k
TDA9817; TDA9818
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
20 k
3.6 V
9 k 22 1.9 V
MHA689
23 24
SIF1 SIF2
3.4 3.4
23 + 1.1 k 5 k 100 A
+
400 A 10 k 1.8 V +
1.1 k 24 800 3.4 V
400 A
MHA690
Note 1. Not connected for TDA9817T and TD9817TS.
2004 Jun 29
30
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VP 22 k 100 nF 1:1 SIF input 50 1 2 3 24 23 22 21 20 19 18 17 16 15(2) 14 13 mute switch 8 9 10 11 12 QSS intercarrier output 560 5.5 MHz(3)
MHA691
TEST AND APPLICATION INFORMATION
Philips Semiconductors
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
AFC
22 k 1.1 V (p-p) video
(1)
5 4
GND TOP 22 k 10 nF
tuner AGC 100 nF 5.6 k 10 nF
CBL
intercarrier mode 1 1:1 VIF input 50 1 2 3 5 4 2.2 F 2.2 F 2 3(2) 4 5
TDA9817 TDA9818
6 7(2)
handbook, full pagewidth
31
330 220 nF
AF 22 output k
2.4 k CDEC
Rx 22 F
22 nF
standards VIF selection AGC switch
SIF AGC
loop filter
L/L accent switch and adjust
de-emphasis 50 s
TDA9817; TDA9818
Product specification
(1) See Table 3. (2) Not connected for TDA9817T and TDA9817TS. (3) Depends on TV standard.
Fig.15 Test circuit.
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VP 22 k 100 nF IF input GND SAW FILTER K9453
(3)
Philips Semiconductors
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
AFC
1 V (p-p) video
22 k
15 H tuner AGC
TOP 22 k SIF 24 23 22 21 20 19 18 17 16 15(2) 14 13 mute switch 8 9 10 11 12 QSS intercarrier output 560 5.5 MHz(3)
MHA692
10 nF
(1)
330
CBL
100 nF
5.6 k 10 nF
intercarrier mode 1 VIF SAW FILTER K3953
(3)
TDA9817 TDA9818
2 3(2) 4 5 6 7(2)
handbook, full pagewidth
32
50
330 2.2 F 2.2 F 220 nF
AF 22 output k
2.4 k
Rx 22 F
22 nF CDEC
standards VIF selection AGC switch
SIF AGC
loop filter
L/L accent switch and adjust
de-emphasis 50 s
TDA9817; TDA9818
Product specification
(1) See Table 3. (2) Not connected for TDA9817T and TDA9817TS. (3) Depends on TV standard.
Fig.16 Application circuit.
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
Table 3 Oscillator circuit for the different TV standards EUROPE 38.9 MHz 77.8 MHz
18 CVCO 8.5 pF C(C9) 8.2 pF 19 L(F4) 251 nH
MHA693
TDA9817; TDA9818
PARAMETER IF frequency VCO frequency Oscillator circuit
USA 45.75 MHz 91.5 MHz
18 CVCO 8.5 pF C(C9) 10 pF 19 L(F4) 163 nH
MHA694
JAPAN 58.75 MHz 117.5 MHz
18 CVCO 8.5 pF C(C9) 15 pF 19 L(F4) 78 nH
MHA695
e.g. Toko coil Philips ceramic capacitor
5KM 369SNS-2010Z 2222 632 51828
5KMC V369SCS-2370Z inside of coil
MC 139 NE545SNAS100108 15 pF SMD; size = 0805
2004 Jun 29
33
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
PACKAGE OUTLINES
SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)
TDA9817; TDA9818
SOT234-1
D
ME
seating plane
A2
A
L
A1 c Z e b 24 13 b1 wM (e 1) MH
pin 1 index E
1
12
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 4.7 A1 min. 0.51 A2 max. 3.8 b 1.3 0.8 b1 0.53 0.40 c 0.32 0.23 D (1) 22.3 21.4 E (1) 9.1 8.7 e 1.778 e1 10.16 L 3.2 2.8 ME 10.7 10.2 MH 12.2 10.5 w 0.18 Z (1) max. 1.6
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT234-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 95-02-04 03-02-13
2004 Jun 29
34
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9817; TDA9818
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
2004 Jun 29
35
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
TDA9817; TDA9818
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 12 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 8.4 8.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.4 8 o 0
o
Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
2004 Jun 29
36
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor
TDA9817; TDA9818
type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all the BGA, HTSSON..T and SSOP-T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
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Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING
TDA9817; TDA9818
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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38
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
Suitability of IC packages for wave, reflow and dipping soldering methods MOUNTING Through-hole mount CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL Through-holesurface mount Surface mount PMFP(4) BGA, HTSSON..T(5), LBGA, LFBGA, SQFP, SSOP-T(5), TFBGA, USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(7), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L(11), PMFP(10), WQCCN32L(11) Notes PACKAGE(1) suitable suitable(3) not suitable not suitable not suitable(6)
TDA9817; TDA9818
SOLDERING METHOD WAVE REFLOW(2) DIPPING - - not suitable suitable suitable suitable - - - -
suitable not not recommended(7)(8) recommended(9)
suitable suitable suitable not suitable
- - - -
not suitable
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. Hot bar soldering or manual soldering is suitable for PMFP packages. 5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 7. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 10. Hot bar or manual soldering is suitable for PMFP packages. 11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request.
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39
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development
TDA9817; TDA9818
DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R25/03/pp41
Date of release: 2004
Jun 29
Document order number:
9397 750 13463

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